Description
Precautions
01. Surface Preparation
Thoroughly clean the bonding surfaces before adhesive application. Remove dust, oil, and other contaminants to ensure the substrates are clean and dry, maintaining stable bonding performance and strength.
02. Application Temperature Control
Strictly control the application temperature. Continuous operation above 180°C is not recommended, as excessive heat may cause adhesive degradation and aging, resulting in reduced bonding performance or adhesive failure.
03. Application Condition Adjustment
The adhesive open time, curing speed, and bonding performance are affected by adhesive temperature, ambient temperature, coating weight, assembly time, and applied pressure. These parameters can be adjusted according to actual production conditions.
04. Safe Handling
Keep the product out of reach of children. Molten adhesive reaches extremely high temperatures and must not be touched with bare hands during operation to prevent thermal burns.
05. First Aid for Burns
In case of accidental burns, immediately immerse the affected area in cool water for more than 10 minutes and seek medical attention promptly.
Key Benefits
01.Dedicated Formula for Electronic Appliance Assembly
Specially developed for TV back panel assembly and electronic appliance manufacturing applications, OGD-9055C can serve as a reliable alternative to traditional double-sided adhesive tapes. It delivers high bonding strength and strong peel resistance, making it suitable for the fixation and assembly of various electronic components and appliance parts.
02.Excellent High-Temperature Stability
With outstanding heat resistance, OGD-9055C maintains stable performance during long-term operation at 150–170°C. It effectively minimizes thermal degradation and adhesive aging, ensuring consistent bonding performance during continuous mass production and preventing delamination of finished products.
03.Dual-Process Compatibility for Automated Production Lines
Compatible with both spray coating and knife coating processes, OGD-9055C works well with standard hot melt adhesive equipment. It provides smooth application performance with minimal stringing and reduced risk of nozzle clogging, making it ideal for high-speed automated electronic assembly lines.
04.Flexible Process Adjustment for Various Requirements
The curing speed, open time, and bonding performance can be adjusted according to application temperature, coating weight, and bonding pressure. Customized solutions can be provided to meet specific requirements such as temperature resistance, VOC control, and curing efficiency.
05.Flame Retardant and Excellent Environmental Resistance
Certified with UL94 V-0 flame retardant performance, OGD-9055C offers excellent resistance to acids, alkalis, and high/low temperature cycling. With low odor and low VOC characteristics, it meets environmental and safety requirements for electronic appliances.
06.Superior Storage Stability and Material Reliability
When stored in a cool, dry environment at room temperature, OGD-9055C provides a 24-month shelf life. Its excellent storage stability helps prevent aging, loss of adhesion, and material degradation, reducing inventory costs and improving production reliability.
